Liquid Metal Thermal Platform
for Semiconductor Systems
Thermal Fluid
We develop electrically insulating thermal fluids with high thermal conductivity, low viscosity, and high dielectric strength by incorporating liquid metals and conductive fillers into high-dielectric base oils at minimal loading. These fluids are designed for advanced immersion and liquid-cooling systems. Performance enhancement is achieved through reduced interfacial thermal resistance and the formation of efficient heat-conduction pathways.
Thermal Grease
Liquid metal–based soft thermal grease is a high-performance thermal interface material that integrates gallium-based liquid metal droplets within a soft polymer matrix for efficient heat transfer. It delivers high thermal conductivity while maintaining softness, easy application, and excellent gap-filling capability. Encapsulation of the liquid metal ensures leakage prevention and corrosion mitigation, making it suitable for high-power electronic devices.
Thermal Pad
Liquid metal–based thermal pads are soft, pre-cut thermal interface materials designed to efficiently transfer heat between components and heat sinks. They provide thermal conductivity ranging from 1 to 20 W/m·K with excellent conformability to irregular surfaces, while remaining electrically insulating for safe and reliable use. These pads are suitable for CPUs, GPUs, memory devices, and EV battery systems requiring long-term thermal stability.
